Technical Data September 2014 3MTM Thermally Conductive Silicone Interface Pad 5514 Product Description 3MTM Thermally Conductive Silicone Interface Pad 5514 is a silicone elastomer sheet, designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders and other cooling devices. Features and Benefits * Good thermal conductivity (1.6 W/m-K) * Good converting for complicated shape * Hardness: Shore 00 = 58 * Good flexibility with over bending * Good dielectric properties * Thin thickness, 0.20 mm and 0.25 mm * UL 94 V-1 * Roll is available * High temperature resistance Product Uses This product can be used for heat management of electronic devices and joining/stacking parts in electronic components. Product Construction 3MTM Thermally Conductive Silicone Interface Pad 5514 Removable Film Liner Thermally Conductive Silicone Elastomer Removable Film Liner Standard thickness (excluding liner): 0.25 mm Application Ideas * IC Packaging Heat Conduction * COF Chip Heat Conduction * Printed Circuit Board * LED Board TIM * Spacer for Battery Module/Pack * HD TV Address IC Chip and Scan Module * Heat Sink by Aluminum, other metal and ceramic * Thin Gap Filling between board, module and chassis Mechanical fastening such as clamp, bracket, screw and additional tapes and adhesives bonding can be used in parallel with this pad. 3MTM Thermally Conductive Silicone Interface Pad 5514 Typical Physical Properties and Performance Characteristics Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. Property 3MTM Thermally Conductive Silicone Interface Pad 5514-20 and 5514-25 Value Method Thickness (mm) 0.20 / 0.25 (0.025mm) - 1.06 QTM-500 Flammability UL 94 V-1 UL 94 Density (g/cm3, @ 25C)* 2.4 (0.25) TS-TM-441 Hardness (Shore 00)* 55 (10) ASTM D2240 Volume Resistivity (-cm)* 8.6 x 1013 ASTM D257 14.15 ASTM D149 Thermal Conductivity (W/mK)* Dielectric Strength (kV/mm)* Dielectric Constant* 100 Hz 1 Khz 1 Mhz 15.7 15.7 15.6 ASTM D150 *3MTM Thermally Conductive Interface Silicone Pad 5514-25 tested. Heat resistance of 3MTM Thermally Conductive Silicone Interface Pad 5514-25 Duration Initial 100 500 1000 Thermal Conductivity (W/mK) 1.6 1.6 1.6 1.6 Hardness (Shore 00) 56 56 56 56 Appearance - No effect No effect No effect Aged at 130C in high temperature chamber. Application Techniques *Positioning is dependent upon the total amount of surface contact developed. Firm application pressure helps develop better contact. *To obtain optimum thermal conductivity, the wetting surfaces must be maximized. For better contact, clean, dry and well unified surface condition is recommended. Typical surface cleaning solvents are isopropyl alcohol and water (rubbing alcohol) or heptane. Note: Be sure to follow manufacturer's safety precautions and directions for use when using solvents. *Ideal application temperature range is from 0C to 40C. Initial application to surfaces at temperatures below 0C is not recommended because the pad becomes too firm to be wetted readily. However, once properly applied, low temperature holding is generally satisfactory. (2) 3MTM Thermally Conductive Silicone Interface Pad 5514 Storage and Shelf Life The shelf life of 3MTM Thermally Conductive Silicone Interface Pad 5514 is 12 months from the manufacture date when stored in original packaging at 21C (70F) and 50% relative humidity. 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